High-precision wet device "BATCHSPRAY Autoload"
100% focus on BATCHSPRAY technology! Significantly reduces water, exhaust, and chemicals [Wet process equipment for the semiconductor industry] Fully automated equipment.
This 4-chamber system is characterized by its ability to achieve excellent process results by combining mixed chemicals at the time of use with a patented retainer comb treatment system. By using SicOzone instead of peroxides or sulfuric acid for sustainable processes such as cleaning and resist stripping, it can reduce the consumption of chemicals and deionized water by up to 90%. By continuously supplying new chemicals to the chamber, it eliminates processing variations due to bath liquid degradation, enabling stable high-precision processes. 【Features】 ■ For wet etching, resist stripping, and cleaning processes ■ Throughput of up to 600 wph ■ Four process chambers ■ Installation area of less than 12 m² ■ Chemicals used at low concentrations until depleted ■ No need for sulfuric acid or peroxides *For more details, please refer to the PDF document or feel free to contact us.
- Company：Siconnex Japan(サイコネックス ジャパン)
- Price：Other
